Orientation

<111>/<100>   surface ±5°

Transmitted wavefront distortion

≤0.1λ/inch

Extinction   ratio

≥25dB

Dimensions

Ø ≤30mm, L ≤220mm; Customizable   as board, wafer

Tolerance

Ø:0/-0.03mm, L:0/+0.5mm

Processing

Grinding, Polishing, Threading

Parallelism

≤10"

Verticality

≤5′

Flatness

λ/10@632.8nm

Surface Quality

10/5(MIL-O-13830A)

Chamfer

0.15±0.05mm

Coating

S1/S2:R≤0.2%@1064nm

S1:R≤0.2%@1064nm，S2:PR＝20-80%@1064nm；

S1:PR＝20-80%@1064nm，S2:HR≥99.8%@1064nm

Customized   other coatings

LIDT

≥5J/cm²@1064nm, 10ns 10Hz

Wavelength

1064 nm

Diode pumped absorption wavelength

808nm

Refractive   index

1.8197@1064nm

Specialty

The high concentration   of flakes can reach 1.8at%;

Surface   metallization

End wedge angle,   concave/convex surface